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Using trench technology and Wirebond packaging process, the product has excellent performance indicators and electrical parameters

The package product specifications are complete, and the power device adopts an innovative structural design. Have customer supporting service advantages in product design

In order to optimize the independent design framework of chip functions, multi-chip interconnection welding technology, high-density wire bonding technology, multi-site high-efficiency IC precision testing technology, high-reliability and high-level packaging technology.

Using PlanarMOSFET, TrenchMOSFET, SuperJunction chip technology products, and Wirebond packaging technology, the products have excellent performance parameters