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Using trench technology and Wirebond packaging process, the product has excellent performance indicators and electrical parameters

The packaging product specifications are complete, and deep technical precipitation has been accumulated in DieBond and Wirebond. FlipChip packaging technology is adopted to provide products with high power density and high reliability.

In order to optimize the independent design framework of chip functions, multi-chip interconnection welding technology, high-density wire bonding technology, multi-site high-efficiency IC precision testing technology, high-reliability and high-level packaging technology.

Using PlanarMOSFET, TrenchMOSFET, SuperJunction chip technology products, and Wirebond packaging technology, the products have excellent performance parameters